This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): Level B LM124 products - /883, SMD and JAN B. ( Reference Table I )
Proposed Date of Change: August 2000 and onward
Description of Change: The LM124 Level B devices manufactured after the above date will no longer have 100% production burn-in. A burn-in process monitor has been established to insure continued quality and reliability. Operational life burn-in will continue to be performed on LM124 JAN B, SMD and /883 product per standard Quality Conformance Inspection rules. This reduction does not affect any Level S, Level S Rad Tolerant, Level B Rad Tolerant or Custom -MLS products.
Under the guidelines of MIL-PRF-38535 QML process reduction procedures, National Semiconductor's Technology Review Board has reviewed and approved this process modification.
Effect of Change: This change should have no impact on quality or reliability to customers. The burn-in process monitor that has been instituted will insure continued process control.
Associated Notes / Table(s):
TABLE I