This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): LM741 883 Products
See Table 1
Proposed Date of Change: June 2, 2003
Description of Change: The LM741 Level devices manufactured after the above datecode will no longer have 100% production burn-in. A burn-in process monitor has been established to ensure continued quality and reliability. Operational life burn-in will continue to be performed on product per standard Quality Conformance Inspection rules.
This reduction does not affect any JAN S, JAN B, Rad Tolerant, or Custom -MLS products. It also does not apply to LM741A (e.g., LM741AH/883) versions of the product.
Under the guidelines of MIL-PRF-38535 QML process reduction procedures, National Semiconductor's Technology Review Board has reviewed and approved this process modification.
Effect of Change: This change should have no impact on quality or reliability to customers. The burn-in process monitor that has been instituted will ensure continued process control.
Associated Notes / Table(s):
TABLE 1
LM741H/883
LM741J/883
LM741W/883
LM741WG/883
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