This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): Logic Family: FAST PRODUCTS
Proposed Date of Change: September 13, 1998
Description of Change: Under the provisions of MIL-PRF-38535, National Semiconductor has moved the process flow location of 100% and group "A" AC/DC testing at -55C and 125C temperature on the FAST logic products.
This change applies to JAN Level B and 883 level FAST devices. This process modification was fully qualified and approved by the National Semiconductor Technology Review Board. Effect of Change: Beginning September 13, 1998, the 100% and Group "A" -55C and 125C AC/DC testing will be performed prior to burn-in for the FAST product family. Group C Operating Life testing will continue in the standard order.
Associated Notes / Table(s):
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