This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): DS96F173 and DS96F175
See Table I
Proposed Date of Change: Datecode 0231 and onward
Description of Change: The DS96F173 and DS96F175 Level B/Q devices manufactured after the above datecode will no longer have 100% production burn-in. A burn-in process monitor has been established to ensure continued quality and reliability. Operational life burn-in will continue to be performed on DS96F173 and DS96F175 Jan B and /883 product per standard Quality Conformance Inspection rules.
This reduction does not affect any Level S, Level S / Level B Rad Tolerant, JAN S, or Custom -MLS products.
Under the guidelines of MIL-PRF-38535 QML process reduction procedures, National Semiconductor's Technology Review Board has reviewed and approved this process modification.
Effect of Change: This change should have no impact on quality or reliability to customers. The burn-in process monitor that has been instituted will ensure continued process control.
Associated Notes / Table(s):
TABLE 1
PACKAGED PRODUCTS
DIE PRODUCTS
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