This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): ALL QML "V" LEVEL AND JAN "S" LEVEL PRODUCTS
Proposed Date of Change: October 18, 1999
Description of Change: THERMAL STABILITY TEST OPTIMIZATION MIL-STD-883 TEST METHOD 5007 (WAFER LOT ACCEPTANCE) Thermal Stability testing is required for each specific wafer lot, for wafer lot acceptance per MIL-STD-883, TM 5007. National Semiconductor's Enhanced Solutions Technical Review Board has approved use of in-line process qualification monitors in lieu of lot specific Thermal Stability testing, for Class "V" and JAN "S" products manufactured on the QMLV lines. National Semiconductor will provide monitor Drift data for each Space Level Wafer Lot Acceptance Report, this data will be the results of the corresponding in-line monitor. The methodology and data were reviewed with DSCC and Aerospace Corportation in accordance with the requirements of MIL-PRF-38535. Concurrence for thermal stablility test optimization was given after reviews of data demonstrated that monitors yield product of equal quality.
Effect of Change: The quality, reliability, and electrical performance of these products will not be adversely affected.
Associated Notes / Table(s):
N/A
This PCN can also be sent to customers by copying and pasting the attached PDF file into an email:-