This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): Level B DS26LS31 products -/883 and SMD (Reference Table I)
Proposed Date of Change: Date Code 0550 and onward.
Description of Change: The DS26LS31 Level B (6 inch, Greenock, Scotland material) devices manufactured after the above date will no longer have 100% production burn-in. A burn-in process monitor has been established to insure continued quality and reliability. Operational life burn-in will continue to be performed on DS26LS31 SMD and /883 product per standard Quality Conformance Inspection rules. This reduction does not affect any Level S, Level S Rad Tolerant, Level B Rad Tolerant or Custom -MLS products. Under the guidelines of MIL-PRF-38535 QML process reduction procedures, National Semiconductor's Technical Review Board has reviewed and approved this process notification.
Effect of Change: This change should have no impact on quality or reliability to customers. The burn-in process monitor that has been instituted will insure continued process control.
Associated Notes / Table(s):
TABLE I
National part Number Standard Microcircuit Drawing
DS26LS31M MD8 DS26LS31M MD8 DS26LS31ME-SMD 5962-7802301Q2A DS26LS31MJ-SMD 5962-7802301MEA DS26LS31MW-SMD 5962-7802301MFA DS26LS31MJ/883 DS26LS31MJ/883 DS26LS31MW/883 AM26LS31MW/883 This PCN can also be sent to customers by copying and pasting the attached PDF file into an email:-