This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): See Table 1
Proposed Date of Change: Datecode 0240 and onward
Description of Change: Under the provisions of MIL-PRF-38535, National Semiconductor has modified the order of the process steps within our test flow. Beginning with datecode 0240, the -55 deg. C and +125 deg. C testing will be performed prior to burn-in for the LM124 Family of Devices.
This change applies to Level B/883 and Standard Microcircuit Drawing (SMD) devices as listed in Table 1.
This does NOT apply to device types with specific customer drawing requirements. This also does NOT apply to JAN B, JAN S, QML V, MLS, or Radiation guaranteed devices.
This process modification was fully qualified and approved by the National Semiconductor Technology Review Board.
Effect of Change: This change should have no impact on quality or reliability to customers.
Associated Notes / Table(s):
Table 1
National Part Number Standard Microcircuit Drawing or Slash Sheet
LM124AE/883 77043022A
LM124AJ/883 7704302CA
LM124AW/883
LM124AWG/883 7704302XA
LM124J/883 7704301CA
LM124WG/883 7704301XA
This PCN can also be sent to customers by copying and pasting the attached PDF file into an email:-