This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): Leadless Ceramic Chip Carrier (LCC), Ceramic Dip with Glass Frit Seal (CERDIP) and Ceramic Flatpack with Glass Frit Seal (CERPAC) devices assembled in Singapore.
All product assurance levels (ie: JAN B, /883, QB, -MIL, MSP) and SCDs that cross over to a standard QML device. (ie; no special electricals and/or process flows).
The EXCEPTIONS to this change are level "S" products and SCDs with special electricals and/or process flows which will NOT be affected.
Proposed Date of Change: Datecode 9534
The first character of the DATECODE will be "S" indicating the assembly site code for Singapore.
Description of Change: CONSTANT ACCELERATION (CENTRIFUGE) TEST ELIMINATION
National Semiconductor was recently granted approval by DESC-EQM to delete Constant Acceleration (centrifuge) testing, reference: Test Method 2001, Mil-Std-883, for ceramic packages under the provisions of the MIL-PRF-38535.
Constant Acceleration Testing was originally implemented to verify the die attach and wirebond integrity. With the continuous improvements made in materials and processes, most products do not fail due to these mechanisms. Additionally, statistical process control (SPC) of these process steps and the data collected over the past years has validated the final SPC performance to constant acceleration testing.
National Semiconductor will continue to perform constant acceleration on an in-line sample basis and for Quality Conformance Inspection. This test can be re-implemented on a specific package if justified by the monitors, a quality concern and/or on a special request basis.
Effect of Change: This change is minor in nature, and National Semiconductor has statistical process controls in place that ensure that the products effected will continue to be able to meet this requirement when tested.
Associated Notes / Table(s):
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