This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): LINEAR DEVICES PACKAGED IN TO3, TO5, TO39 & TO46 METAL CANS: - SMD (M,B LEVELS) METAL CANS - QB/883 LEVELS METAL CANS - JM38510 (B LEVEL) METAL CANS NOTE: This change does NOT include Level S product.
Proposed Date of Change: JUNE 1996
Description of Change: ELIMINATION OF CENTRIFUGE TESTING Under the provisions of MIL-PRF-38535, National Semiconductor has eliminated the centrifuge test (constant acceleration) from the environmental tests that are performed on metal can packaged Linear devices.
Data gathered has shown that the die attach and wire bond pull process operations far exceed the centrifugal force applied to the die during the centrifuge test.
This process modification was fully qualified and approved by the National Semiconductor Technology Review Board.
Effect of Change: The quality, reliability, interchangeability and electrical performance will not be adversely affected.
Associated Notes / Table(s):
** THIS ADDENDUM DOCUMENTS THE JM38510 B LEVEL METAL CANS BEING INCLUDED IN THIS PROCESS ELIMINATION.
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