This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): ALL QML "V" LEVEL AND JAN "S" LEVEL PRODUCTS
Proposed Date of Change: FEBRUARY 1, 1996
Description of Change: OPERATING LIFE TEST OPTION MIL-STD-883 TEST METHOD 1005 (STEADY STATE LIFE) National Semiconductor will implement the option to perform life test on each wafer lot rather than each assembly lot, for Class "V" and JAN "S" products manufactured on QML certified lines.
Implementation of the option will be upon approval of National Semiconductor's Technical Review Board (TRB), and be in accordance with MIL-PRF-38535, appendix B, Para. 40.2, c-ii. This action comes after extensive discussions with, and concurrence by, customers, DESC, NASA, AF/SMC, and the Aerospace Corporation. Concurrence for the life test option was given after reviews of data demonstrated that the assembly and test sites yield product of equal quality.
The life test data that will be used for this option is on product from National Semiconductor's previously certified assembly and test operations in South Portland, Maine. This option will extend to product assembled in the certified assembly sites of National's Singapore facility and Sertech Labs.
For those customers who prefer to have a life test performed on their specific lot, National Semiconductor will continue to offer assembly lot specific life test as an option.
Effect of Change: As Class "S" wafer lots are homogeneous throughout the wafer fabrication process, it is redundant to perform operating life testing on each assembly run built from the same wafer lot.
The quality, reliability, and electrical performance of these products will not be adversely affected.
Associated Notes / Table(s):
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