HI-REL OPERATIONS
DESIGN / PROCESS CHANGE NOTIFICATION
PCN Nr: MA2001-01 Issued: 01/09/2001
GIDEP Nr: AH6-C-01-11GIDEP Category: PCNTRB Nr: 168
Summary: LM129 Temperature Coefficient


This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):


Product ID (Description):
Voltage References

LM129AH/883
LM129AH-SMD 5962-8992101XA
LM129BH/883

Proposed Date of Change:
Datecode 0052

Description of Change:
Under the provisions of MIL-PRF-38535, National Semiconductor has moved the process flow location of TEMPCO (Temperature Coefficient) testing on the LM129 devices.

This change applies to Level B /883 and Standard Microcircuit Drawing (SMD) devices.

This process modification was fully qualified and approved by the National Semiconductor Technology Review Board.

Effect of Change:
Beginning with datecode 0052, the TEMPCO testing will be performed prior to burn-in for the LM129 devices.
For further questions contact:
North America
Europe
QA Manager
Tel: 408-721-3509
Email: Dennis.Tanguay.@nsc.com
Tel: +49 (0)8141 35-1483 / 1402
PCN Manager
Tel: 408-721-3161
Email: susan.davis@nsc.com
Hi Rel Operations Marketing:
Tel: +49 (0)8141 35 1360
Email:
Paul.McCormack@nsc.com
Customer Support Center
Tel: 1-800-272-9959
Email: support@nsc.com
Tel: +49 (0)180 530 8585 (German)
Tel: +49 (0)180 532 7832 (English)
Email: europe.support@nsc.com
Other contacts
Larry McGee
Analog Product Line Eng. Mgr.
(408) 721-7231
email: larry.mcgee@nsc.com
Other Ref: None

Associated Notes / Table(s):

N/A


This PCN can also be sent to customers by copying and pasting
the attached PDF file into an email:-

MA2001-01.pdf