This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):
Product ID (Description): See Table 1
Proposed Date of Change: Datecode 0303 and onward
Description of Change: Under the provisions of MIL-PRF-38535, National Semiconductor has modified the order of the process steps within our test flow. Beginning with datecode 0303, the -55 deg. C and +125 deg. C testing will be performed prior to burn-in for the LM139 Family of Devices.
This change applies to Level B/883 and Standard Microcircuit Drawing (SMD) devices as listed in Table 1.
This does NOT apply to device types with specific customer drawing requirements. This also does NOT apply to JAN B, JAN S, QML V, MLS, or Radiation guaranteed devices.
This process modification was fully qualified and approved by the National Semiconductor Technology Review Board.
Effect of Change: This change should have no impact on quality or reliability to customers.
Associated Notes / Table(s):
Table 1
National Part Number Standard Microcircuit Drawing or Slash Sheet
LM139AE-SMD 5962-87739012A
LM139AE/883
LM139AJ-SMD 5962-8773901CA
LM139AH/883
LM139AW-SMD 5962-8773901DA
LM139AW/883
LM139AWG-SMD 5962-8773901XA
LM139AWG/883
LM139E/883
LM139J/883
LM139W/883
LM139WG/883
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