Position Title: Senior Module Engineer
Company Profile:
National Semiconductor creates analog-intensive solutions that differentiate customers' products by providing lower power consumption, higher speed, greater precision, increased portability, better audio and sharper images in electronics systems. National’s leading-edge, energy-efficient analog products enhance personal mobile devices (cellphones, smartphones and MP3 players), LED lighting and electronics such as medical, automotive, and test and measurement equipment. Its SolarMagic technology, launched in 2008, is built upon National’s analog and power management circuits and provides enhanced energy output of solar arrays. Headquartered in Santa Clara, Calif., National reported sales of $1.46 billion for its most recent fiscal year.
Job Description:
National Semiconductor creates energy-efficient analog and mixed-signal semiconductors. Its PowerWise® products enable systems that consume less power, extend battery life, and generate less heat. National's leading-edge products include power management circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. Headquartered in Santa Clara, Calif., National reported sales of $1.89 billion for fiscal 2008 which ended May 25, 2008.
Job Description:
As our Senior Module Packaging Engineer, you will be responsible for the following:
* Working with cross-functional teams to develop leading edge packaging solutions (processes, packages, modules) for applications requiring high reliability, high voltage, and high temperature (e.g., hybrid power management devices and modules, power MOSFETs, IGBTs, HFETs, high voltage gate drivers, motor controllers, power switching at high temperatures, etc.).
* Working from broadly defined specifications to develop low-cost packages and modules with a high degree of integration while meeting performance and reliability; this will likely involve a combination of internal development work and collaboration with suppliers, universities, and external consortia.
* Interacting with internal and external customers, subcontractors, and equipment and materials suppliers.
* Maintaining a broad network of users and suppliers.
* Staying current with packaging process development in the industry, universities, and research centers.
* Conducting competitive benchmarking in package and module designs, materials, manufacturing processes, and reliability performance.
Qualifications:
* MS in EE or ME with 5 years, or BS in EE or ME with 7 to 10 years, mandatory working experience in related fields of power electronics; must be familiar with design, materials selection, and mfg practices of modules carrying high current and dissipating high power while still meeting EMS and reliability requirements.
* Must be familiar with automotive specs AEC-Q100 requirements and Automotive Product Introduction documentation and requirements.
* Experience in Multi Chip Modules (MCM), Multi Chip Packages (MCP), System In Package (SiP) for automotive applications such as hybrid electric vehicles is highly desirable; should have working knowledge of systems, package constructions, interconnect schemes, material technologies, thermal management, process and manufacturing techniques, and components such as magnetics and high energy density capacitors (e.g., ultracaps, supercaps, etc.).
* Familiarity with heterogeneous integration is desirable.
* Thorough experience in the SMT process; need to understand the implications of assembly and rework thermal hierarchy on component and module system reliability.
* Hands-on experience with assembly, processes, reliability, and failure analysis for flip chip, CSP, FBGA, SiP, and MCM required.
* Familiar with package design, thermal, and electrical modeling tools.
As an equal opportunity employer, National Semiconductor encourages and supports a diverse workplace. |